Automatic Chip Mounter

Automatic Chip Mounter

Electronic industry: mobile phone frame shell, FPC, PCB, camera lens, camera module, etc.
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Description

Technical Parameters

Features:

 

◎It can realize multi-product patching, reduce labor in the product combination (can replace 5-6 labor), improve efficiency (can reach 5-6K points per hour), improve accuracy and stability (can achieve patching accuracy range Within ±0.05MM, and the fluctuation value does not exceed 0.02MM), making production more automatic and intelligent

◎ SMT precision ±0.1mm;

◎ SMT yield ≥98%;

◎ Production capacity is up to 3600CPH;

 

Application:

 

◎ Electronic industry: mobile phone frame shell, FPC, PCB, camera lens, camera module, etc.

Industry: 3M double-sided adhesive, protective film, label, buffer foam, conductive foam, conductive cloth, insulation mylar, thermal conductive silica gel, etc.

◎ Non-vacuum plane bonding of adhesive materials.

◎ Accessory materials, soft board, keyboard

 

product-750-505

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FAQ

 

1.Q: What about the lead time for mass production?

A:15-20 working days for mass production.It depends on your quantity,and we will try our best to meet your needs.

 

2.Q: Are you a factory or a trading company?

A: We are factories and manufacturers.

 

3.Q: Where is your factory? How can I get there?

A: Our factory is located at No.2 He Li Road, Quantang Industrial Zone, Liaobu Town, Dongguan city, Guangdong Province, China. You can fly directly to Shenzhen Bao 'an Airport. Warmly welcome customers at home and abroad to visit and guide!

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Name

parameter

Mount speed

≥3600CPH

SMT precision

±0.1mm

In the scope of

2mm-80mm

Debugging time

<10min/star

External dimensions of equipment

1100(W)*1250(D)*1550(H)

Support incoming sizes

350(L)*260(W)

Maximum thickness of incoming material

8mm

largest load

4kg

SMT capacity

At the same time, three kinds of auxiliary materials can be affixed

Rail transport system

Double track system, automatic reflux

Communication interface

SMEMA

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